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Solder Mask Layer and Silk Screen Layer : The Technology and Function Behind PCB Color

Solder Mask Layer and Silk Screen Layer : The Technology and Function Behind PCB Color

June 04, 2025

When you pick up a PCB, the first visual impact often comes from its bright colors: the classic green solder mask, the eye-catching white silk screen characters, or the dirt-resistant black coating on industrial equipment. These colors are not only a choice of design aesthetics, but also a functional decision that has been verified by long-term engineering. This article will deeply analyze the material science, process technology, cost structure of the solder mask and silk screen layer and their impact on product reliability, revealing the technical logic behind the color selection.

 

1. Solder mask: the art of balancing protection and process

 

 

Solder mask is an insulating protective layer covering the conductive pattern of PCB. Its core function is to prevent solder bridging, resist environmental erosion, and provide precise positioning reference for subsequent assembly. Green solder mask has long dominated PCB manufacturing due to its mature process, cost advantages and excellent detection performance.

The procurement cost of mainstream green ink is 15-30% lower than that of special colors, and the supply chain is stable and reliable. In terms of optical inspection, green (L*≈55) and copper foil (L*≈20-30) form the best contrast, making the AOI system's false detection rate less than 0.1%, and the recognition of red solder repair marks on a green background is as high as 85%, which is significantly better than other color combinations. In addition, modern green solder mask ink has passed RoHS certification, and the glass transition temperature (Tg) after curing can reach above 150°C, which can not only meet environmental protection requirements, but also adapt to harsh application scenarios such as automotive electronics, achieving a perfect balance between performance and cost.

 

Engineering Considerations for Special Colors

 

Color Type

Typical application scenarios

Process Challenges

Cost increase

White

Display backlight panel (such as LED light panel)

Requires high hiding power ink, easy to produce bubbles

+20-40%

Black

Consumer electronics (such as mobile phone motherboards)

Need to add carbon black pigment, the bending resistance is reduced

+30-50%

Blue

Medical equipment (low fluorescence required)

Special additives are needed to inhibit UV reflection

+15-30%

Red

Repair Marking/Test Plate

The curing temperature needs to be adjusted to avoid color difference

+10-20%

 

2. Silkscreen layer: information transmission and manufacturing collaboration

 

The silk-screen layer carries key information such as component identification, polarity marking, test point number, etc. Its design directly affects production yield and after-sales maintenance efficiency.

 

 

The mainstream choice of white silk screen

 

(1)Readability core indicators

· Contrast calculation: White characters (L*≈95) form a high contrast of ΔE≈35 on green solder mask (meeting ANSI/IPC-7351 standard), which can be clearly identified even at a 30° tilted viewing angle.

· Ink characteristics: Use high hiding power epoxy resin-based ink (such as Sun Chemical 7100 series), adhesion ≥ Grade 1 (ASTM D3359), and solder resistance temperature can reach 260℃/10s.

 

(2)Key points of design specifications

· Line width limit: The minimum character width is recommended to be ≥0.8mm (corresponding to 7mil line width). Too thin may cause ink cracking (laboratory tests show that the cracking rate of 0.5mm line width in bending test is >15%).

· Height and spacing: The character height is usually 1.5-3mm, and the spacing is ≥1.2 times the character width to avoid accidental touch during assembly.

 

Color selection for special scenarios

 

Application Requirements

Recommended colors

Technical considerations

High temperature environment (such as engine compartment)

Black

Resistant to UV yellowing, but ink thickness needs to be increased(≥15μm)

High density board (HDI)

Yellow

Reduce the risk of visual confusion between characters and pads

Medical Devices

Light Blue

Meets IEC 60601-1-2 anti-glare requirements

 

3. Process collaboration and innovation trends

 

Process coupling of solder mask and silk screen printing

 

· Ink compatibility test:The interlayer adhesion of white silk screen ink and green solder mask layer must pass the 85℃/85%RH 1000h aging test (IPC-TM-650 standard), otherwise delamination may occur.

· Co-curing optimization:The risk of stress cracking can be reduced by using a staged curing process (e.g., first 150°C/3min solder mask curing, then 180°C/2min screen curing).

 

Emerging Technology Breakthroughs

 

· White Laser Direct Structuring (LDS):It can replace traditional silk screen printing to realize dynamic identification of three-dimensional curved surface components (such as automotive HUD modules), but the cost is high (about $0.3/cm²).

· Smart solder mask ink: Add temperature-variable/light-variable pigments for anti-tampering marking (such as military equipment), and the color changes from green to red when the temperature changes (ΔT=50℃).

 

Conclusion

 

The color selection of PCB is not a simple aesthetic decision, but a deep combination of material science, manufacturing process, cost control and usage scenarios. The combination of green solder mask and white silk screen has become the industry standard due to its perfect balance between manufacturability, reliability and economy. With the miniaturization and multifunctional development of electronic products, more functional solder mask materials (such as self-healing ink) and intelligent silk screen technology may appear in the future, pushing PCB design into a new dimension.

 

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